EDGE

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4-3-8 Commander-in-Chief of the AI Compute Network: Accton Technology (2345)'s System-Level Dominance in 800G/1.6T Switches
Semiconductor
EDGE / / 6 minutes read

4-3-8 Commander-in-Chief of the AI Compute Network: Accton Technology (2345)'s System-Level Dominance in 800G/1.6T Switches

Accton, the white-box switch leader, capitalizes on the 800G/1.6T upgrade wave. Its AI accelerator card (AI-NIC) business saw 361% YoY growth, its strongest second pillar. Through L11 rack integration and NPO/CPO pre-research, Accton is the commander-in-chief of the 102.4T compute network.
4-3-7 Igniting the Spark of AI: Epitaxial Leader Arima Lasers (3081) and Packaging Veteran Lingsen Precision (3450)
Semiconductor
EDGE / / 6 minutes read

4-3-7 Igniting the Spark of AI: Epitaxial Leader Arima Lasers (3081) and Packaging Veteran Lingsen Precision (3450)

Arima Lasers (3081), global InP epi-wafer choke point, masters silicon photonics' CW laser 'ignition source'; capacity driven by NVIDIA's 20x expansion. Lingsen Precision (3450) shifts from traditional packaging to high-ASP COS/ELS, achieving 20% operating margin by 2025, a high-end P&T transform...
4-3-6 CPO Packaging Special Forces: The Precision Alignment of InnoLight-KY (6451), Optiworks (3363), and BroadWeb (3163)
Semiconductor
EDGE / / 8 minutes read

4-3-6 CPO Packaging Special Forces: The Precision Alignment of InnoLight-KY (6451), Optiworks (3363), and BroadWeb (3163)

Precision is key beyond 1.6T. InnoLight-KY (6451) masters 102.4T SiP P&T. Optiworks (3363) leverages patented ReLFACon™ FAU for TSMC COUPE 1.6T CPO link. BroadWeb (3163) dominates high-density Fiber Harness external optical management, targeting high margins.
4-3-5 Ultimate Combination —— CPO (Co-Packaged Optics) and TSMC COUPE
Semiconductor
EDGE / / 6 minutes read

4-3-5 Ultimate Combination —— CPO (Co-Packaged Optics) and TSMC COUPE

TSMC's COUPE via SoIC-X enables 3D PIC/EIC vertical stacking, cutting transmission distance. Against laser heat sensitivity, ELS/RLS (External Laser Source) architecture emerged, relocating heat from chassis. This "full-stack" strategy creates a "de-packaging" survival crisis for traditional modu...
The Leading Player in 4-3-4 CPO: Google's Co-Packaged Optics Ambitions and Broadcom's Bailly Platform
Semiconductor
EDGE / / 5 minutes read

The Leading Player in 4-3-4 CPO: Google's Co-Packaged Optics Ambitions and Broadcom's Bailly Platform

Google pushes OCS & CPO tech for power saving in millions of TPU clusters. Broadcom's Bailly platform, the first commercial 51.2T/102.4T CPO system, cuts 70% power. This revolution vertically compresses supply chain, making silicon photonics dominant solution post-2028.
4-3-3: Leading Module Players in Taiwan: E-Da Technology (4977), LuxNet Corp. (4979), and OptiWorks Inc. (6442)'s 1.6T Dividend
Semiconductor
EDGE / / 8 minutes read

4-3-3: Leading Module Players in Taiwan: E-Da Technology (4977), LuxNet Corp. (4979), and OptiWorks Inc. (6442)'s 1.6T Dividend

Taiwanese firms shifted value in 1.6T era. E-Da Technology deeply partnered with Marvell for co-dev; LuxNet Corp. monopolized US CSP access via 6,912+ core panels; OptiWorks Inc. leveraged global OEM resilience/yield to become Broadcom's key production hub.