Edge Quant Technology

We specialize in Taiwan stock microstructure and semiconductor supply chains. Using AI to decode 'Smart Money' flows, we turn proprietary data into actionable insights for robust Alpha

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EDGE / / 23 minutes read

【EDGE Dual Momentum Weekly Report】20260423 AI Computing Power Ignites High-Speed Transmission, Capital Bets Heavily on Market Leaders

The Taiwan equity market continues to leverage the EDGE Dual-Track Core Matrix as AI compute expansion ignites surging demand for high-speed transmission. Capital is increasingly concentrated in market leaders across CCL, CPO, and silicon photonics segments. Concurrently, the CoWoS capacity crunch i
EDGE / / 15 minutes read

[Weekly Industry Chip Analysis] 20260420: CCL Material Share Lock-up and the Capital Siphon Effect of Silicon IP

A pronounced capital rotation was observed this week towards Taiwan's semiconductor upstream, with significant inflows into Copper Clad Laminate (CCL), PCB substrate, and Silicon IP sectors. This strategic shift is catalyzed by the imminent mass production of NVIDIA’s Blackwell architecture, which i
EDGE / / 12 minutes read

[Semiconductor Consensus Tracker] 20260419 AI Consensus Diverges; Capital Becomes Selective

As of April 19, 2026, the semiconductor sector exhibits a strategic bifurcation in AI sentiment, prompting highly selective capital flows. Earnings momentum remains concentrated within the AI data center ecosystem, notably benefiting Advanced Micro Devices (AMD) and Micron Technology (MU). AMD’s MI3
EDGE / / 21 minutes read

【EDGE Dual Momentum Weekly】20260415 AI Computing Power Surge, Capital Bets Heavily on Networking

The surge in AI compute demand is aggressively igniting a global infrastructure buildout, positioning Taiwan's ecosystem as a primary beneficiary. Applying the EDGE Dual-Track Core Matrix, foreign investors remain heavily concentrated in high-speed networking switches (800G) and CCL/PCB leaders. Mea
EDGE / / 22 minutes read

【EDGE Dual Momentum Weekly】20260408 AI Packaging Arms Race: Major Boost for the Substrate Supply Chain

The global AI packaging arms race is fueling a massive substrate supply chain boom, prompting foreign investors to aggressively accumulate positions in PCB, CCL, and ABF leaders. Concurrently, rapid CoWoS capacity expansion is accelerating a surge in domestic equipment orders. Beyond high-performanc
EDGE / / 20 minutes read

【Industry Capital Flows Weekly】20260406 – Macro Capital Rotation and Underlying Investor Positioning Resonance Analysis

Funds executed 'liquidity-masked selling' in IC Design/Peripherals (highs, valuation/margin squeeze). Smart money shifts to Electronic Components (thermal/high-speed infra). Shun chip/foundry bull traps; favor tech-moat components.
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