EDGE

/ 135 posts
2-6-1 Structural Evolution Theory —— Why Can't the Faucet Be Shut Off Tightly?
Semiconductor
EDGE / / 7 minutes read

2-6-1 Structural Evolution Theory —— Why Can't the Faucet Be Shut Off Tightly?

Transistor scaling caused quantum leakage, failing 2D architecture. TSMC's 3D FinFET dominated 16-3nm. At 2nm, FinFET hit physical limits, forcing a shift to GAA (Gate-All-Around). GAA, via suspended nanosheets, provides 360° perfect control, fully resolving leakage, offering channel width flexib...
The Limits of the 2-6-0 Blueprint — When Tools Cannot Overcome Physical Laws
Semiconductor
EDGE / / 6 minutes read

The Limits of the 2-6-0 Blueprint — When Tools Cannot Overcome Physical Laws

As process technology nears 3nm, upgrading advanced equipment alone can't save Moore's Law. Transistor gates thinned to atomic scale trigger the "quantum tunneling effect," causing severe leakage and heat. Facing physical limits, fabs must fundamentally rebuild their architecture, moving from 2D ...
2-5-4 The Art of Quality Control —— Inspection and Metrology
Semiconductor
EDGE / / 8 minutes read

2-5-4 The Art of Quality Control —— Inspection and Metrology

Wafer quality control entails dimension measurement & defect inspection. KLA built deep front-end barriers via its yield database, dominating over 50% market share as 'semiconductor landlord.' CoWoS packaging sparked a back-end inspection revolution, with 3D micro-solder ball inspection demand su...
2-5-3 The Art of Change —— Ion Implantation and CMP Planarization
Semiconductor
EDGE / / 11 minutes read

2-5-3 The Art of Change —— Ion Implantation and CMP Planarization

Pure silicon undergoes ion implantation for impurity introduction and thermal annealing for lattice repair. AMAT dominates standard processes; Axcelis monopolizes SiC automotive. CMP planarization flattens wafers, solving photolithography focus issues and is core to CoWoS packaging. AMAT solely d...
[Industry Capital Flows Weekly] 20260215 Capitalizing on AI Specification Bonuses, Avoiding Equipment Makers' Book-Closing Sell-off
Insight
EDGE / / 26 minutes read

[Industry Capital Flows Weekly] 20260215 Capitalizing on AI Specification Bonuses, Avoiding Equipment Makers' Book-Closing Sell-off

This week, large funds prioritize 'selective strengthening and intertemporal allocation'. Amid high index volatility, Smart Money heavily targets 'AI infrastructure' and 'semiconductor cycle recovery' supply chains. Overvalued, fundamentally weak sub-sectors face ruthless liquidation. Capital rap...
2-5-1 The Art of Addition — Thin Film Deposition and ALD Mastery
Semiconductor
EDGE / / 5 minutes read

2-5-1 The Art of Addition — Thin Film Deposition and ALD Mastery

Deposition builds chip conductive/insulating layers. PVD (physical sputtering, AMAT-led); CVD (gas chemical films); ALD (2nm processes, single-atom LBL, perfect 3D encap, boosts ASMI). Copper fill: Lam Research. AMAT 'King of Addition', ALD future core.