144 posts
4-2-1 The Absolute Realm of Physics – Copper Clad Laminates (CCL) and the Ultra-High Frequency Marvel of Dk/Df
Semiconductor
EDGE / / 9 minutes read

4-2-1 The Absolute Realm of Physics – Copper Clad Laminates (CCL) and the Ultra-High Frequency Marvel of Dk/Df

AI servers' ultra-high freq. transmission makes CCL critical for computing power. Success depends on Dk (speed) and Df (signal integrity). To counter high-freq. signal loss and skin effect, materials must upgrade from epoxy to PPO resin and HVLP copper. This pushes AI substrates to the Df<0.002 M...
3-5-2 A Hybrid of Logic and Memory: Powerchip's Heterogeneous Integration Revolution
Semiconductor
EDGE / / 5 minutes read

3-5-2 A Hybrid of Logic and Memory: Powerchip's Heterogeneous Integration Revolution

Powerchip expects 2026 capacity surge & financial rebound via mature process shortages. Core 'heterogeneous integration' (3D WoW/AIM) vertically merges logic/memory, solving edge AI bandwidth/power bottlenecks. Micron alliance & HBM pre-processing transform Powerchip to system-level packaging pla...
3-5-1 Avoiding the Giants' Battlefield — Winbond Electronics and Nanya Technology's Specialty DRAM Strategy
Semiconductor
EDGE / / 6 minutes read

3-5-1 Avoiding the Giants' Battlefield — Winbond Electronics and Nanya Technology's Specialty DRAM Strategy

As three giants pivot to HBM & DDR5, Nanya Tech & Winbond Electronics defend niche DRAM. Nanya Tech, with its 1B process, targets 10nm-class & DDR4 gaps for ASP surges. Winbond uses 16nm for low-density specs, building IoT/edge computing long-tail monopolies. This is a survival battle, avoiding d...
4-1-5 Formosa Plastics Group's Transformation — Nanya PCB (8046)'s High-End Yield Battle
Semiconductor
EDGE / / 6 minutes read

4-1-5 Formosa Plastics Group's Transformation — Nanya PCB (8046)'s High-End Yield Battle

Nanya PCB (8046), leveraging Formosa Plastics Group's vertical integration, once led network communication substrates. Despite a painful "yield wall" in early AI GPU substrates, management quickly stemmed losses, heavily investing in a new Shulin plant for high-end HPC. Nanya PCB launched a diffe...
4-1-4 The Capacity King's Expansion —— Unimicron (3037)'s ABF Red Ocean Breakthrough and Counterattack
Semiconductor
EDGE / / 10 minutes read

4-1-4 The Capacity King's Expansion —— Unimicron (3037)'s ABF Red Ocean Breakthrough and Counterattack

Unimicron, global AI capacity leader, saw AI HDI lines turn profitable early. It leveraged T-Glass shortages to regain pricing power, restarting "capacity reservation fees." Unimicron upholds capital discipline, de-bottlenecking for cash flow, and secretly develops ultimate large organic substrat...
4-1-3 The Counterattack of Glass —— Intel's TGV Revolution and Ultimate Flatness
Semiconductor
EDGE / / 8 minutes read

4-1-3 The Counterattack of Glass —— Intel's TGV Revolution and Ultimate Flatness

AI chip heat warps ABF substrates; industry eyes glass (flatness, rigidity, thermal stability for trillion-transistor). LIDE/chemical etching solves TGV fragility. Intel seeks revenge; SK builds mass plant; Unimicron test-produces, sparking 2027 materials war.