144 posts
2-5-3 The Art of Change —— Ion Implantation and CMP Planarization
Semiconductor
EDGE / / 11 minutes read

2-5-3 The Art of Change —— Ion Implantation and CMP Planarization

Pure silicon undergoes ion implantation for impurity introduction and thermal annealing for lattice repair. AMAT dominates standard processes; Axcelis monopolizes SiC automotive. CMP planarization flattens wafers, solving photolithography focus issues and is core to CoWoS packaging. AMAT solely d...
[Industry Capital Flows Weekly] 20260215 Capitalizing on AI Specification Bonuses, Avoiding Equipment Makers' Book-Closing Sell-off
Insight
EDGE / / 26 minutes read

[Industry Capital Flows Weekly] 20260215 Capitalizing on AI Specification Bonuses, Avoiding Equipment Makers' Book-Closing Sell-off

This week, large funds prioritize 'selective strengthening and intertemporal allocation'. Amid high index volatility, Smart Money heavily targets 'AI infrastructure' and 'semiconductor cycle recovery' supply chains. Overvalued, fundamentally weak sub-sectors face ruthless liquidation. Capital rap...
2-5-1 The Art of Addition — Thin Film Deposition and ALD Mastery
Semiconductor
EDGE / / 5 minutes read

2-5-1 The Art of Addition — Thin Film Deposition and ALD Mastery

Deposition builds chip conductive/insulating layers. PVD (physical sputtering, AMAT-led); CVD (gas chemical films); ALD (2nm processes, single-atom LBL, perfect 3D encap, boosts ASMI). Copper fill: Lam Research. AMAT 'King of Addition', ALD future core.
2-5-2 The Art of Subtraction — Etching and Cleaning
Semiconductor
EDGE / / 5 minutes read

2-5-2 The Art of Subtraction — Etching and Cleaning

Semiconductor etching, or "subtraction," is Lam Research's domain. Advanced processes use precise dry plasma etching. Lam's HAR & ALE are key for 3D NAND/GAA. Post-etch cleaning is critical: TEL dominates front-end. Hermes-Epitek & Scientech dominate CoWoS back-end cleaning, seizing market.
2-5-0 Materialization Project: The Big Three Equipment Companies and the Building Cycle
Semiconductor
EDGE / / 7 minutes read

2-5-0 Materialization Project: The Big Three Equipment Companies and the Building Cycle

Chipmaking (nano-skyscrapers). ASML blueprints; physical build by 'big three'. Process: deposition, lithography, etching, planarization (dozens of repeats). Applied Materials growth; Lam etches; TEL coats; KLA inspects. These teams permeate processes, building a 'steel Great Wall' for chips.
2-4-5 A Comprehensive Analysis of TSMC's Specialty Chemical Supply Chain: Identifying 5 Major Hidden Champions
Semiconductor
EDGE / / 7 minutes read

2-4-5 A Comprehensive Analysis of TSMC's Specialty Chemical Supply Chain: Identifying 5 Major Hidden Champions

Semiconductor materials, continuous consumables, provide stable cash flow. This article identifies five key players: Japanese firms monopolize lithography; EU/US firms, gases. In Taiwan, Tai-Chemical (silane) & Crystalwise (special cylinders) make breakthroughs. Yu Chuan dominates ALD precursors;...