2-5-2 The Art of Subtraction — Etching and Cleaning
Semiconductor etching, or "subtraction," is Lam Research's domain. Advanced processes use precise dry plasma etching. Lam's HAR & ALE are key for 3D NAND/GAA. Post-etch cleaning is critical: TEL dominates front-end. Hermes-Epitek & Scientech dominate CoWoS back-end cleaning, seizing market.
2-5-0 Materialization Project: The Big Three Equipment Companies and the Building Cycle
Chipmaking (nano-skyscrapers). ASML blueprints; physical build by 'big three'. Process: deposition, lithography, etching, planarization (dozens of repeats). Applied Materials growth; Lam etches; TEL coats; KLA inspects. These teams permeate processes, building a 'steel Great Wall' for chips.
2-4-5 A Comprehensive Analysis of TSMC's Specialty Chemical Supply Chain: Identifying 5 Major Hidden Champions
Semiconductor materials, continuous consumables, provide stable cash flow. This article identifies five key players: Japanese firms monopolize lithography; EU/US firms, gases. In Taiwan, Tai-Chemical (silane) & Crystalwise (special cylinders) make breakthroughs. Yu Chuan dominates ALD precursors;...
2-4-4 The 'Bathwater' of Wafers —— Wet Process and Taiwan's Alchemy
Wafer production is 30% cleaning; PPT-pure chemicals are vital, or nanoparticles destroy yield. Beyond TMAH developer and Piranha solution (SPM), containers and recycling are key. UPC masters Teflon-lined technology for uncontaminated chemical delivery; SCF purifies and regenerates waste liquids,...
2-4-3 The Soul of Photolithography —— Photoresist and the Japanese Empire
Photoresist is lithography's soul. EUV's RLS impossibility triangle (resolution, roughness, sensitivity) requires CAR/MOR breakthroughs. 90% of market monopolized by 5 Japanese firms (JSR, Shin-Etsu); JSR's privatization is a national strategy. Most Taiwanese firms distribute. Only Topco uses R&D...
2-4-1 The Film of the Battlefield: Photomask Technology (Photomask)
EUV photomasks use 80-layer MoSi mirrors; atomic defects challenge interference focusing. TSMC initially skipped pellicles for yield, now using carbon nanotubes. A 3nm photomask costs NT$1B. NRE makes advanced processes a giant oligopoly; small fabs use MPW.
2-3-2 The Final Gamble — Intel 14A vs. TSMC A16: The Roadmap Battle
ASML's High-NA EUV boosts resolution via anamorphic lenses, halving exposure fields and causing chip stitching. This sparks a battle: Intel bets on new machines for tech lead; TSMC uses older machines, multi-patterning for cost/yield. Photoresists need metallic scaffolds. Short-term, TSMC wins av...
2-3-1 God's Paintbrush —— The ASML EUV Ecosystem and Its Miracles
ASML's $4.8B EUV lithographer: industry's crown jewel. Lasers bombard tin 50k/s, producing 13.5nm EUV. Light easily absorbed; Zeiss mirrors guide 2% to wafer. Monopoly: Lasertec (Japan/inspection), Gudeng (Taiwan/reticle pods). 100k precision parts integration hinders China's replication. Moore's...
2-2-0 Photolithography in Plain Language: A Nanoscale 'Template Spray Painting' Game
Gemini said: Photolithography is nanoscale template spray-painting. We coat a wafer with photoresist, then light through a mask alters it. Unwanted resist is washed off, leaving a protective layer. Exposed wafer areas are then etched. After stripping the resist, circuit structures are created. Th...