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Nanya PCB (8046), leveraging Formosa Plastics Group's vertical integration, once led network communication substrates. Despite a painful "yield wall" in early AI GPU substrates, management quickly stemmed losses, heavily investing in a new Shulin plant for high-end HPC. Nanya PCB launched a diffe...
4-1-4 The Capacity King's Expansion —— Unimicron (3037)'s ABF Red Ocean Breakthrough and Counterattack
Unimicron, global AI capacity leader, saw AI HDI lines turn profitable early. It leveraged T-Glass shortages to regain pricing power, restarting "capacity reservation fees." Unimicron upholds capital discipline, de-bottlenecking for cash flow, and secretly develops ultimate large organic substrat...
4-1-3 The Counterattack of Glass —— Intel's TGV Revolution and Ultimate Flatness
AI chip heat warps ABF substrates; industry eyes glass (flatness, rigidity, thermal stability for trillion-transistor). LIDE/chemical etching solves TGV fragility. Intel seeks revenge; SK builds mass plant; Unimicron test-produces, sparking 2027 materials war.
4-1-2 The Jewel in the Crown — ABF Leaders Ibiden and Shinko's Historical Heritage
Ibiden & Shinko, tied to Intel, monopolized high-end ABF. Amid AI surge, both adopted strategies. Ibiden invests JPY 500B in AI ASIC/EMIB-T; clients prepay. Shinko, privatized/delisted by a Japan gov consortium, avoids reporting pressure, focusing on next-gen substrate capital drain, defending se...
4-1-6 The Vanguard of the Pegatron Group — Kinsus (3189)'s Differentiated Survival and Resurgence
Kinsus (3189) initially dominated BT substrates and had a contact lens cash cow. Now, flush with cash, it enters AI; ABF capacity hits 85% off-season. Amid material gaps, Kinsus began 3-5% quarterly price hikes, approved Fab 6 high-end expansion, targeting GPU/ASIC/high-end networking, using a du...
4-1-1 The Plastic Throne of Chips —— The Physical Miracle of ABF and Ajinomoto's Crossover Legend
ABF film, the core IC substrate insulator, is monopolized by Japan's Ajinomoto. Its thin, insulative, laser-drillable properties make it the industry standard. Substrate manufacturing involves lamination cycles (film, drilling, plating), like building a layered cake. However, chips like NVIDIA B2...
4-0 The Superhighway Beyond the Brain — Why Does Computing Power Need a Good Mattress?
AI servers rely on IC substrates for 'Space Transformation' as chip traces are 50,000x finer than PCB traces, precluding direct solder. IC substrates funnel nano signals, enlarge pitch, convert to PCB solder balls—the first hub linking compute power externally.
3-4 Breaking the Memory Wall —— CXL Interconnect Technology and PIM Processing-in-Memory
To overcome server capacity limits, CXL brings memory's 'USB moment' via PCIe for pooling & expansion, cutting cloud costs & sparking control chip demand. To end the 'data movement tax,' PIM integrates compute units into DRAM, enabling in-situ, no-movement computation. These shatter the Von Neuma...
3-3 Data Skyscraper —— The Magic of 3D NAND and Controller Chips
3D NAND vertical stacking breaks capacity bottlenecks; Lam Research's high-aspect-ratio etching is critical. QLC, for AI storage, mitigates inherent flaws via controller algorithms. aiDAPTIV+ extends SSDs into computational units, reshaping the AI storage value chain.
