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The EDGE Semiconductor Research Zone provides in-depth analysis of the global chip industry's complex supply chain, from FinFET to silicon photonics. We cover AI, geopolitics, and rapid tech iteration with continuously updated insights, empowering you to master critical variables and make informed decisions.

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4-1-1 The Plastic Throne of Chips —— The Physical Miracle of ABF and Ajinomoto's Crossover Legend
Semiconductor
EDGE / / 7 minutes read

4-1-1 The Plastic Throne of Chips —— The Physical Miracle of ABF and Ajinomoto's Crossover Legend

ABF film, the core IC substrate insulator, is monopolized by Japan's Ajinomoto. Its thin, insulative, laser-drillable properties make it the industry standard. Substrate manufacturing involves lamination cycles (film, drilling, plating), like building a layered cake. However, chips like NVIDIA B2...
4-1-6 The Vanguard of the Pegatron Group — Kinsus (3189)'s Differentiated Survival and Resurgence
Semiconductor
EDGE / / 7 minutes read

4-1-6 The Vanguard of the Pegatron Group — Kinsus (3189)'s Differentiated Survival and Resurgence

Kinsus (3189) initially dominated BT substrates and had a contact lens cash cow. Now, flush with cash, it enters AI; ABF capacity hits 85% off-season. Amid material gaps, Kinsus began 3-5% quarterly price hikes, approved Fab 6 high-end expansion, targeting GPU/ASIC/high-end networking, using a du...
4-1-2 The Jewel in the Crown — ABF Leaders Ibiden and Shinko's Historical Heritage
Semiconductor
EDGE / / 10 minutes read

4-1-2 The Jewel in the Crown — ABF Leaders Ibiden and Shinko's Historical Heritage

Ibiden & Shinko, tied to Intel, monopolized high-end ABF. Amid AI surge, both adopted strategies. Ibiden invests JPY 500B in AI ASIC/EMIB-T; clients prepay. Shinko, privatized/delisted by a Japan gov consortium, avoids reporting pressure, focusing on next-gen substrate capital drain, defending se...
4-1-3 The Counterattack of Glass —— Intel's TGV Revolution and Ultimate Flatness
Semiconductor
EDGE / / 8 minutes read

4-1-3 The Counterattack of Glass —— Intel's TGV Revolution and Ultimate Flatness

AI chip heat warps ABF substrates; industry eyes glass (flatness, rigidity, thermal stability for trillion-transistor). LIDE/chemical etching solves TGV fragility. Intel seeks revenge; SK builds mass plant; Unimicron test-produces, sparking 2027 materials war.
4-1-5 Formosa Plastics Group's Transformation — Nanya PCB (8046)'s High-End Yield Battle
Semiconductor
EDGE / / 6 minutes read

4-1-5 Formosa Plastics Group's Transformation — Nanya PCB (8046)'s High-End Yield Battle

Nanya PCB (8046), leveraging Formosa Plastics Group's vertical integration, once led network communication substrates. Despite a painful "yield wall" in early AI GPU substrates, management quickly stemmed losses, heavily investing in a new Shulin plant for high-end HPC. Nanya PCB launched a diffe...
3-5-1 Avoiding the Giants' Battlefield — Winbond Electronics and Nanya Technology's Specialty DRAM Strategy
Semiconductor
EDGE / / 6 minutes read

3-5-1 Avoiding the Giants' Battlefield — Winbond Electronics and Nanya Technology's Specialty DRAM Strategy

As three giants pivot to HBM & DDR5, Nanya Tech & Winbond Electronics defend niche DRAM. Nanya Tech, with its 1B process, targets 10nm-class & DDR4 gaps for ASP surges. Winbond uses 16nm for low-density specs, building IoT/edge computing long-tail monopolies. This is a survival battle, avoiding d...