Semiconductor

/ 125 posts

The EDGE Semiconductor Research Zone provides in-depth analysis of the global chip industry's complex supply chain, from FinFET to silicon photonics. We cover AI, geopolitics, and rapid tech iteration with continuously updated insights, empowering you to master critical variables and make informed decisions.

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EDGE / / 8 minutes read

4-1-3 The Counterattack of Glass —— Intel's TGV Revolution and Ultimate Flatness

AI chip heat warps ABF substrates; industry eyes glass (flatness, rigidity, thermal stability for trillion-transistor). LIDE/chemical etching solves TGV fragility. Intel seeks revenge; SK builds mass plant; Unimicron test-produces, sparking 2027 materials war.
EDGE / / 10 minutes read

4-1-2 The Jewel in the Crown — ABF Leaders Ibiden and Shinko's Historical Heritage

Ibiden & Shinko, tied to Intel, monopolized high-end ABF. Amid AI surge, both adopted strategies. Ibiden invests JPY 500B in AI ASIC/EMIB-T; clients prepay. Shinko, privatized/delisted by a Japan gov consortium, avoids reporting pressure, focusing on next-gen substrate capital drain, defending se...
EDGE / / 7 minutes read

4-1-6 The Vanguard of the Pegatron Group — Kinsus (3189)'s Differentiated Survival and Resurgence

Kinsus (3189) initially dominated BT substrates and had a contact lens cash cow. Now, flush with cash, it enters AI; ABF capacity hits 85% off-season. Amid material gaps, Kinsus began 3-5% quarterly price hikes, approved Fab 6 high-end expansion, targeting GPU/ASIC/high-end networking, using a du...
EDGE / / 7 minutes read

4-1-1 The Plastic Throne of Chips —— The Physical Miracle of ABF and Ajinomoto's Crossover Legend

ABF film, the core IC substrate insulator, is monopolized by Japan's Ajinomoto. Its thin, insulative, laser-drillable properties make it the industry standard. Substrate manufacturing involves lamination cycles (film, drilling, plating), like building a layered cake. However, chips like NVIDIA B2...
EDGE / / 3 minutes read

4-0 The Superhighway Beyond the Brain — Why Does Computing Power Need a Good Mattress?

AI servers rely on IC substrates for 'Space Transformation' as chip traces are 50,000x finer than PCB traces, precluding direct solder. IC substrates funnel nano signals, enlarge pitch, convert to PCB solder balls—the first hub linking compute power externally.
EDGE / / 8 minutes read

3-4 Breaking the Memory Wall —— CXL Interconnect Technology and PIM Processing-in-Memory

To overcome server capacity limits, CXL brings memory's 'USB moment' via PCIe for pooling & expansion, cutting cloud costs & sparking control chip demand. To end the 'data movement tax,' PIM integrates compute units into DRAM, enabling in-situ, no-movement computation. These shatter the Von Neuma...