Semiconductor

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The EDGE Semiconductor Research Zone provides in-depth analysis of the global chip industry's complex supply chain, from FinFET to silicon photonics. We cover AI, geopolitics, and rapid tech iteration with continuously updated insights, empowering you to master critical variables and make informed decisions.

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4-2-6 The Undisputed Leader in Cloud Motherboards — Gold Circuit Electronics (2368)'s Thick Board Moat
Semiconductor
EDGE / / 9 minutes read

4-2-6 The Undisputed Leader in Cloud Motherboards — Gold Circuit Electronics (2368)'s Thick Board Moat

Gold Circuit Electronics, global No.1 CSP supplier, leveraging two decades in server thick boards. 2026 PCIe 6.0 upgrade will inflate motherboard layers to 20-24, boosting unit prices 20-30%. Its AWS Trainium 3 ASIC market share will expand to 50-60%, challenging NVIDIA Rubin's 44-layer interpose...
The Dimensional Reduction Strike of 4-2-7 HDI — Compeq (2313) and Apex (2367)'s OAM Surprise Attack
Semiconductor
EDGE / / 7 minutes read

The Dimensional Reduction Strike of 4-2-7 HDI — Compeq (2313) and Apex (2367)'s OAM Surprise Attack

Compeq leveraged global #1 HDI tech, surprising AI OAM from satellite/mobile. It holds 70-90% LEO satellite board share; satellite is a key gross profit pillar as SpaceX nears 10M users. 2026 server revenue projects 84% YoY surge; Thailand plant accelerates AI rigid board capacity. Apex transform...
4-2-8 Profitability Star Performer and System Behemoth —— Kingstate (3044) and Zhen Ding Technology (4958)'s Plate War
Semiconductor
EDGE / / 9 minutes read

4-2-8 Profitability Star Performer and System Behemoth —— Kingstate (3044) and Zhen Ding Technology (4958)'s Plate War

Kingstate (3044) avoided AI's high capex, efficiently dominating 40% general server and 55% DRAM module markets where peers exited, achieving AI-like profits. Zhen Ding (4958) raised $400M for carrier boards, leveraging Hon Hai's EMS for full GB200 system supply chain penetration. These two giant...
4-3-1 The Dusk of Copper Wire: The 224Gbps Physical High Wall and LPO Cross-Generational Technology
Semiconductor
EDGE / / 7 minutes read

4-3-1 The Dusk of Copper Wire: The 224Gbps Physical High Wall and LPO Cross-Generational Technology

As single-channel rates approach 224Gbps (1.6T spec), electrical signal loss on copper wires hits physical limits. Over 1 meter, copper signals severely distort and overheat, forcing data centers to fully shift from copper to optical. This isn't a cost choice, but a physical necessity to break th...
4-3-2 Global Optical Module Dominant Players: Marvell, Lumentum, and Coherent's 1.6T Monopoly Battle
Semiconductor
EDGE / / 6 minutes read

4-3-2 Global Optical Module Dominant Players: Marvell, Lumentum, and Coherent's 1.6T Monopoly Battle

The global 1.6T market is defined by three giants: Marvell levies a "brain tax" with its 3nm DSP chips; Lumentum defines mass production pace with EML laser chip capacity (40% expansion); and Coherent, leveraging vertically integrated indium phosphide materials and modules, secured historic major...
The Leading Player in 4-3-4 CPO: Google's Co-Packaged Optics Ambitions and Broadcom's Bailly Platform
Semiconductor
EDGE / / 5 minutes read

The Leading Player in 4-3-4 CPO: Google's Co-Packaged Optics Ambitions and Broadcom's Bailly Platform

Google pushes OCS & CPO tech for power saving in millions of TPU clusters. Broadcom's Bailly platform, the first commercial 51.2T/102.4T CPO system, cuts 70% power. This revolution vertically compresses supply chain, making silicon photonics dominant solution post-2028.