Semiconductor

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The EDGE Semiconductor Research Zone provides in-depth analysis of the global chip industry's complex supply chain, from FinFET to silicon photonics. We cover AI, geopolitics, and rapid tech iteration with continuously updated insights, empowering you to master critical variables and make informed decisions.

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7-1-1 The Heart Maker: Wistron (3231)'s L6 Substrate Dominance and Transformation Legend
Semiconductor
EDGE / / 6 minutes read

7-1-1 The Heart Maker: Wistron (3231)'s L6 Substrate Dominance and Transformation Legend

Wistron (3231) transformed from low-margin OEM to a key NVIDIA AI server L6 substrate supplier. Its SMT yield secures "AI heart" manufacturing for L6 boards (>80% cost), benefiting Blackwell's ramp-up. Despite high-priced components diluting GM, operating/absolute profits grow with scale. Via par...
6-4 Power Structure: Who is Defining the Specifications?
Semiconductor
EDGE / / 9 minutes read

6-4 Power Structure: Who is Defining the Specifications?

Analyzing the AI data center spec battle. NVIDIA controls the supply chain using its closed NVL72 architecture, as cloud giants push OCP standards to counter monopoly. Wiwynn specializes in ASICs; Lotes excels in core components. Vertiv shows dominance via integrated facilities & prefabricated so...
6-3-5 Silence of the Deep: Immersion Cooling (Immersion) and the Chemical Warfare of PFAS
Semiconductor
EDGE / / 9 minutes read

6-3-5 Silence of the Deep: Immersion Cooling (Immersion) and the Chemical Warfare of PFAS

This article examines the immersion cooling industry's chemical challenges and restructuring post-3M's PFAS exit. Two-phase shifts to Chemours' compliant coolants; single-phase uses synthetic oils to bypass hermetic limits. This materials science & regulatory play, key beyond just physical perfor...
6-3-4 Liquid Cooling's Heart and Blood Vessels: The Flow War of CDU, Manifold, and QD
Semiconductor
EDGE / / 10 minutes read

6-3-4 Liquid Cooling's Heart and Blood Vessels: The Flow War of CDU, Manifold, and QD

AI liquid cooling cores: CDU (efficient vacuum brazing; Gao-Li benchmark via tech barriers), manifold, QD (drip-free hot-swappable; Jia-Ze challenges US via precision machining). Rack power >100kW boosts 2026 in-row cooling output, strengthening Taiwan's critical liquid cooling supply chain posit...
6-3-3 The Rivalry of Two Titans: Auras Technology (3324)'s Liquid Cooling Boom and Group A Strategy
Semiconductor
EDGE / / 8 minutes read

6-3-3 The Rivalry of Two Titans: Auras Technology (3324)'s Liquid Cooling Boom and Group A Strategy

This analysis details Auras Technology's AI liquid cooling tech moat. It maximizes heat dissipation via micro-fins & turbulent flow channels, ensured leak-free by vacuum welding. As a core NVIDIA Group A member, it's boosted by the GB300 project ramp-up, achieving record revenue. With Thailand's ...
6-3-2 The Final Gasp of Air Cooling: Auras Technology's (3017) 3D VC Dominance and the 1000W Physical Limit
Semiconductor
EDGE / / 12 minutes read

6-3-2 The Final Gasp of Air Cooling: Auras Technology's (3017) 3D VC Dominance and the 1000W Physical Limit

AI chip power >1000W brings air cooling to physical/parasitic limits. Thermal leader Auras Technology (3017) built a deep moat with 3D VC's yield/in-house edge for high-end computing, leveraging 3D VC cash to expedite liquid cooling cold plate/manifold markets, becoming an amphibious industry win...