Semiconductor

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The EDGE Semiconductor Research Zone provides in-depth analysis of the global chip industry's complex supply chain, from FinFET to silicon photonics. We cover AI, geopolitics, and rapid tech iteration with continuously updated insights, empowering you to master critical variables and make informed decisions.

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5-1-10 OSAT Giants' Counterattack Defense Line: ASE Technology Holding (ASE) and Amkor's VIPack
Semiconductor
EDGE / / 10 minutes read

5-1-10 OSAT Giants' Counterattack Defense Line: ASE Technology Holding (ASE) and Amkor's VIPack

OSAT firms counter TSMC's lead & China's price wars. ASE builds a moat via LEAP/VIPack, with flexible capacity & heterogeneous integration. Amkor targets high-end auto/US clients; Powertech focuses on HBM. All shift to system integration, pursuing AI breakthroughs.
The 5-2-2 HBM Stacking Crucible: The MR-MUF Crusade and Powertech Technology (6239)'s Sparkling Water Strategy
Semiconductor
EDGE / / 15 minutes read

The 5-2-2 HBM Stacking Crucible: The MR-MUF Crusade and Powertech Technology (6239)'s Sparkling Water Strategy

Analyzing HBM packaging challenges (thermal leakage, high-temp warpage in ultra-thin stacking), contrasting Samsung's precise but inefficient TC-NCF (causing yield bottlenecks) with SK Hynix's breakthrough MR-MUF, a 'holy war' at physical limits crucial for product yield and memory giants' AI-era...
5-2-4 Die Bonder: The Ultimate Micron Showdown – Global Hegemons vs. Taiwan's Wonbond (6187) and Jinhua (6640) Carving Out Their Niche
Semiconductor
EDGE / / 15 minutes read

5-2-4 Die Bonder: The Ultimate Micron Showdown – Global Hegemons vs. Taiwan's Wonbond (6187) and Jinhua (6640) Carving Out Their Niche

Die bonder challenges in packaging: Surging AI chip value mandates micron-precision thermocompression bonding, high barriers. Dutch Besi (hybrid bonding) & HK's ASMPT (advanced packaging) dominate. Taiwan's Wonbond and Jinhua seek niche breakthroughs, vying with foreign hegemons for packaging.
5-3-5 Ultimate Mutation and Cross-Industry Slaughter: TSMC's CoPoS Panel Frenzy, NVIDIA's CoWoP Substrate Assassin, and the PCB Reshuffle War
Semiconductor
EDGE / / 11 minutes read

5-3-5 Ultimate Mutation and Cross-Industry Slaughter: TSMC's CoPoS Panel Frenzy, NVIDIA's CoWoP Substrate Assassin, and the PCB Reshuffle War

AI chip sizes push physical limits. TSMC promotes CoPoS, adopting panel-level packaging to boost capacity. NVIDIA leads CoWoP's substrate-less approach, directly connecting interposers to PCBs, addressing ABF substrate costs/warping. These two paths will fundamentally reshape the supply chain, tr...
5-4-3 Yingwei (6515)'s Golden Consumables War: FT Test Sockets and Extreme Cooling
Semiconductor
EDGE / / 8 minutes read

5-4-3 Yingwei (6515)'s Golden Consumables War: FT Test Sockets and Extreme Cooling

Yingwei built tech barriers with FT and SLT test sockets. As AI chip power exceeds kW, its thermal fluid engineering & coaxial shielding effectively solve extreme heat & signal interference. Benefiting from surging SLT demand, high-priced HyperSocket will scale up in 2026. In an era of expensive ...
6-1-2 Showdown of Two Giants in the Power Industry (Part 1): Delta Electronics (2308)'s Comprehensive Empire
Semiconductor
EDGE / / 9 minutes read

6-1-2 Showdown of Two Giants in the Power Industry (Part 1): Delta Electronics (2308)'s Comprehensive Empire

Delta Electronics (2308) is now an AI data center integrator. Facing high-power thermal runaway, it offers integrated grid-to-chip liquid cooling via power/thermal co-design and an HVDC end-to-end blueprint. Its high vertical integration and single responsibility secured cloud giants, dictated sp...