Semiconductor

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The EDGE Semiconductor Research Zone provides in-depth analysis of the global chip industry's complex supply chain, from FinFET to silicon photonics. We cover AI, geopolitics, and rapid tech iteration with continuously updated insights, empowering you to master critical variables and make informed decisions.

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5-1-4 Microsurgery for Overcoming Distance: Bumping (Long Bump)'s Material Evolution
Semiconductor
EDGE / / 9 minutes read

5-1-4 Microsurgery for Overcoming Distance: Bumping (Long Bump)'s Material Evolution

Article analyzes advanced packaging's 'long bump' process, key for efficient AI chip transmission. Materials evolved from solder balls to stable copper pillars due to miniaturization/heat. This sparked a TSMC-ASE power struggle, driving capacity gains for wet process suppliers (Grand Plastic, Sci...
5-1-3 MPI Corporation (6223) and Chunghwa Precision Test Technology (6510)'s Probe Cards —— Safeguarding the Lifeline of KGD Yield
Semiconductor
EDGE / / 18 minutes read

5-1-3 MPI Corporation (6223) and Chunghwa Precision Test Technology (6510)'s Probe Cards —— Safeguarding the Lifeline of KGD Yield

AI's Chiplet drive multiplies multi-chip yield issues, KGD critical. Probe cards, for precise microscopic wafer electrical testing, create a high barrier via precision/materials. Their consumable nature (wear, updates) ensures a stable economic model; MPI & CHPT guard advanced packaging yield.
5-1-2 The Harsh Reality of Testing: This Isn't QA, But a 'Capital Allocation Tool'
Semiconductor
EDGE / / 10 minutes read

5-1-2 The Harsh Reality of Testing: This Isn't QA, But a 'Capital Allocation Tool'

Semiconductor testing, in advanced processes, is a 'capital allocation tool'. It prevents sunk costs, intercepting defective bare die pre-costly packaging, saving scarce capacity. Maximizes wafer gross margins via precise chip quality pricing & grading tech. This is a strategic risk control for g...
5-1-1 Overall Perspective: What is Packaging? — The End of the Semiconductor Journey and the "Four Sacred Tasks"
Semiconductor
EDGE / / 12 minutes read

5-1-1 Overall Perspective: What is Packaging? — The End of the Semiconductor Journey and the "Four Sacred Tasks"

Packaging, the chip's 'physical body,' protects fragile bare die. Evolved into sophisticated 'power armor,' it manages AI chip power for stability, shortens transmission via advanced tech, and breaks the memory wall. Not just a shell, it's a physical battleground critical to AI performance and un...
4-3-8 Commander-in-Chief of the AI Compute Network: Accton Technology (2345)'s System-Level Dominance in 800G/1.6T Switches
Semiconductor
EDGE / / 6 minutes read

4-3-8 Commander-in-Chief of the AI Compute Network: Accton Technology (2345)'s System-Level Dominance in 800G/1.6T Switches

Accton, the white-box switch leader, capitalizes on the 800G/1.6T upgrade wave. Its AI accelerator card (AI-NIC) business saw 361% YoY growth, its strongest second pillar. Through L11 rack integration and NPO/CPO pre-research, Accton is the commander-in-chief of the 102.4T compute network.
4-3-7 Igniting the Spark of AI: Epitaxial Leader Arima Lasers (3081) and Packaging Veteran Lingsen Precision (3450)
Semiconductor
EDGE / / 6 minutes read

4-3-7 Igniting the Spark of AI: Epitaxial Leader Arima Lasers (3081) and Packaging Veteran Lingsen Precision (3450)

Arima Lasers (3081), global InP epi-wafer choke point, masters silicon photonics' CW laser 'ignition source'; capacity driven by NVIDIA's 20x expansion. Lingsen Precision (3450) shifts from traditional packaging to high-ASP COS/ELS, achieving 20% operating margin by 2025, a high-end P&T transform...