EDGE

The global 1.6T market is defined by three giants: Marvell levies a "brain tax" with its 3nm DSP chips; Lumentum defines mass production pace with EML laser chip capacity (40% expansion); and Coherent, leveraging vertically integrated indium phosphide materials and modules, secured historic major...

As single-channel rates approach 224Gbps (1.6T spec), electrical signal loss on copper wires hits physical limits. Over 1 meter, copper signals severely distort and overheat, forcing data centers to fully shift from copper to optical. This isn't a cost choice, but a physical necessity to break th...

Kingstate (3044) avoided AI's high capex, efficiently dominating 40% general server and 55% DRAM module markets where peers exited, achieving AI-like profits. Zhen Ding (4958) raised $400M for carrier boards, leveraging Hon Hai's EMS for full GB200 system supply chain penetration. These two giant...

Compeq leveraged global #1 HDI tech, surprising AI OAM from satellite/mobile. It holds 70-90% LEO satellite board share; satellite is a key gross profit pillar as SpaceX nears 10M users. 2026 server revenue projects 84% YoY surge; Thailand plant accelerates AI rigid board capacity. Apex transform...

Gold Circuit Electronics, global No.1 CSP supplier, leveraging two decades in server thick boards. 2026 PCIe 6.0 upgrade will inflate motherboard layers to 20-24, boosting unit prices 20-30%. Its AWS Trainium 3 ASIC market share will expand to 50-60%, challenging NVIDIA Rubin's 44-layer interpose...

AI servers elevate PCBs to "high-tech art." High-freq/speed demands shifted processing from mechanical drilling to laser-drilled HDI. Blind/buried vias & Any-layer tech are OAM module standards for routing. "Back drilling" removes excess copper stubs to mitigate signal reflection. GB200 pioneers ...