EDGE

This analysis details Auras Technology's AI liquid cooling tech moat. It maximizes heat dissipation via micro-fins & turbulent flow channels, ensured leak-free by vacuum welding. As a core NVIDIA Group A member, it's boosted by the GB300 project ramp-up, achieving record revenue. With Thailand's ...

AI chip power >1000W brings air cooling to physical/parasitic limits. Thermal leader Auras Technology (3017) built a deep moat with 3D VC's yield/in-house edge for high-end computing, leveraging 3D VC cash to expedite liquid cooling cold plate/manifold markets, becoming an amphibious industry win...

In the CoWoS era, heat spreaders are critical for AI chip protection. Kenmec (3653) uses 'precision cold forging' to overcome warpage, achieving micron-level flatness for optimal heat dissipation and yield. Its one-stop plating/stiffener frame service grants strong pricing power, a semiconductor ...

This article analyzes semiconductor interface thermal challenges, revealing the 'pump-out effect' caused by thermal expansion coefficient differences. Emphasizing AI server long-term stability, it introduces Phase Change Materials (PCM) that, via solid-liquid conversion, fill air gaps and resist ...

The article examines AI server EMI challenges from high-frequency switching; common mode inductors & decoupling capacitors ensure voltage stability. Murata, with material science & nanoscale MLCCs, builds AI supply chain barriers, showing structural growth in high-end passive components from comp...

AI chips' extreme V/kA challenge motherboard power, driving 'phase explosion'. PMICs' multi-phase/precision control solves high-load transient response. MPS leads single-chip integration; Renesas builds M&A solutions. Traditional inductors hit limits, making TLVR, M-CLL, vertical power key AI bat...