142 posts
6-1-1 Ending AC Loss: HVDC (High-Voltage Direct Current)'s Overt Strategy for Cost Savings
Semiconductor
EDGE / / 7 minutes read

6-1-1 Ending AC Loss: HVDC (High-Voltage Direct Current)'s Overt Strategy for Cost Savings

HVDC cuts data center AC/DC conversion losses. 380V centralized rectification boosts HVDC efficiency, despite current sharing & arc suppression. 100kW+ AI rack power strains 48V. Industry shifts to 800V power chains & SiC, reshaping global power/materials.
6-0 Strategic Outpost —— Runaway Power Consumption and the Collision with 'Physical Walls'
Semiconductor
EDGE / / 6 minutes read

6-0 Strategic Outpost —— Runaway Power Consumption and the Collision with 'Physical Walls'

6-0 Strategic Outpost: Runaway Power & Physical Walls. AI/GPU surges stress data centers (consumption, limits, Joule heating, transient currents). Article covers 'Sixth Battlefield' solutions (HV rack power, 3rd-gen semiconductors, liquid cooling) for energy system transformation, analyzing Delta...
5-4-6 The Ultimate Forensic Examiner: A Microscopic Analysis Platform and the 'Big Three' in Material Analysis and Testing
Semiconductor
EDGE / / 7 minutes read

5-4-6 The Ultimate Forensic Examiner: A Microscopic Analysis Platform and the 'Big Three' in Material Analysis and Testing

This article explores how the 'Big Three' in semiconductor testing act as ultimate forensic examiners, using FIB and TEM to overcome AOI blind spots for atomic-level failure analysis. Pan-Chip employs precise techniques for advanced process MA; MA-tek expands globally, capitalizing on localizatio...
5-4-5 Hongjing Technology (7769) and the Burning Execution Ground: The Death Bathtub Curve of Burn-in (Aging Test)
Semiconductor
EDGE / / 5 minutes read

5-4-5 Hongjing Technology (7769) and the Burning Execution Ground: The Death Bathtub Curve of Burn-in (Aging Test)

AI chips shift to 100% full burn-in inspection from sample testing to overcome 'bathtub curve' early failures. Hongjing (7769) leads global sorters, ensuring ±10μm precision via dynamic thermal compensation for high-temp metal expansion alignment. Its tech is critical for stable global high-end c...
5-4-4 Ultimate System Boss: SLT (System-Level Test) and Chroma ATE (2360)'s EDA-level Adhesion
Semiconductor
EDGE / / 6 minutes read

5-4-4 Ultimate System Boss: SLT (System-Level Test) and Chroma ATE (2360)'s EDA-level Adhesion

Chroma dominates AI chip SLT, vital for simulation, using active thermal control to lock temps in milliseconds, managing intense heat. Deeply coupled with chip firmware, high switching costs & stickiness are ensured. With surging high-stress testing/measurement, Chroma becomes a core AI infra met...
5-4-3 Yingwei (6515)'s Golden Consumables War: FT Test Sockets and Extreme Cooling
Semiconductor
EDGE / / 8 minutes read

5-4-3 Yingwei (6515)'s Golden Consumables War: FT Test Sockets and Extreme Cooling

Yingwei built tech barriers with FT and SLT test sockets. As AI chip power exceeds kW, its thermal fluid engineering & coaxial shielding effectively solve extreme heat & signal interference. Benefiting from surging SLT demand, high-priced HyperSocket will scale up in 2026. In an era of expensive ...