Featured posts
EDGE / / 9 minutes read

6-4 Power Structure: Who is Defining the Specifications?

Analyzing the AI data center spec battle. NVIDIA controls the supply chain using its closed NVL72 architecture, as cloud giants push OCP standards to counter monopoly. Wiwynn specializes in ASICs; Lotes excels in core components. Vertiv shows dominance via integrated facilities & prefabricated so...
EDGE / / 9 minutes read

6-3-5 Silence of the Deep: Immersion Cooling (Immersion) and the Chemical Warfare of PFAS

This article examines the immersion cooling industry's chemical challenges and restructuring post-3M's PFAS exit. Two-phase shifts to Chemours' compliant coolants; single-phase uses synthetic oils to bypass hermetic limits. This materials science & regulatory play, key beyond just physical perfor...
EDGE / / 10 minutes read

6-3-4 Liquid Cooling's Heart and Blood Vessels: The Flow War of CDU, Manifold, and QD

AI liquid cooling cores: CDU (efficient vacuum brazing; Gao-Li benchmark via tech barriers), manifold, QD (drip-free hot-swappable; Jia-Ze challenges US via precision machining). Rack power >100kW boosts 2026 in-row cooling output, strengthening Taiwan's critical liquid cooling supply chain posit...
EDGE / / 8 minutes read

6-3-3 The Rivalry of Two Titans: Auras Technology (3324)'s Liquid Cooling Boom and Group A Strategy

This analysis details Auras Technology's AI liquid cooling tech moat. It maximizes heat dissipation via micro-fins & turbulent flow channels, ensured leak-free by vacuum welding. As a core NVIDIA Group A member, it's boosted by the GB300 project ramp-up, achieving record revenue. With Thailand's ...
EDGE / / 12 minutes read

6-3-2 The Final Gasp of Air Cooling: Auras Technology's (3017) 3D VC Dominance and the 1000W Physical Limit

AI chip power >1000W brings air cooling to physical/parasitic limits. Thermal leader Auras Technology (3017) built a deep moat with 3D VC's yield/in-house edge for high-end computing, leveraging 3D VC cash to expedite liquid cooling cold plate/manifold markets, becoming an amphibious industry win...
EDGE / / 11 minutes read

6-3-1 Metal Bodyguards for Chips: Kenmec (3653) and Flatness Anxiety in the CoWoS Era

In the CoWoS era, heat spreaders are critical for AI chip protection. Kenmec (3653) uses 'precision cold forging' to overcome warpage, achieving micron-level flatness for optimal heat dissipation and yield. Its one-stop plating/stiffener frame service grants strong pricing power, a semiconductor ...
EDGE / / 9 minutes read

6-3-0 The Origin of Heat: Chemical Warfare at the Microscopic Interface and Invisible Killers

This article analyzes semiconductor interface thermal challenges, revealing the 'pump-out effect' caused by thermal expansion coefficient differences. Emphasizing AI server long-term stability, it introduces Phase Change Materials (PCM) that, via solid-liquid conversion, fill air gaps and resist ...
EDGE / / 8 minutes read

6-2-4: The Gatekeeper of Safety Regulations – The EMI Nightmare at High Frequencies and the Front-Line Arsenal

The article examines AI server EMI challenges from high-frequency switching; common mode inductors & decoupling capacitors ensure voltage stability. Murata, with material science & nanoscale MLCCs, builds AI supply chain barriers, showing structural growth in high-end passive components from comp...
EDGE / / 11 minutes read

6-2-3 Explosion of Power Phases: The Inductor War of PMIC, M-CLL, and TLVR

AI chips' extreme V/kA challenge motherboard power, driving 'phase explosion'. PMICs' multi-phase/precision control solves high-load transient response. MPS leads single-chip integration; Renesas builds M&A solutions. Traditional inductors hit limits, making TLVR, M-CLL, vertical power key AI bat...