Semiconductor

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The EDGE Semiconductor Research Zone provides in-depth analysis of the global chip industry's complex supply chain, from FinFET to silicon photonics. We cover AI, geopolitics, and rapid tech iteration with continuously updated insights, empowering you to master critical variables and make informed decisions.

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2-5-4 The Art of Quality Control —— Inspection and Metrology
Semiconductor
EDGE / / 8 minutes read

2-5-4 The Art of Quality Control —— Inspection and Metrology

Wafer quality control entails dimension measurement & defect inspection. KLA built deep front-end barriers via its yield database, dominating over 50% market share as 'semiconductor landlord.' CoWoS packaging sparked a back-end inspection revolution, with 3D micro-solder ball inspection demand su...
2-5-3 The Art of Change —— Ion Implantation and CMP Planarization
Semiconductor
EDGE / / 11 minutes read

2-5-3 The Art of Change —— Ion Implantation and CMP Planarization

Pure silicon undergoes ion implantation for impurity introduction and thermal annealing for lattice repair. AMAT dominates standard processes; Axcelis monopolizes SiC automotive. CMP planarization flattens wafers, solving photolithography focus issues and is core to CoWoS packaging. AMAT solely d...
2-5-1 The Art of Addition — Thin Film Deposition and ALD Mastery
Semiconductor
EDGE / / 5 minutes read

2-5-1 The Art of Addition — Thin Film Deposition and ALD Mastery

Deposition builds chip conductive/insulating layers. PVD (physical sputtering, AMAT-led); CVD (gas chemical films); ALD (2nm processes, single-atom LBL, perfect 3D encap, boosts ASMI). Copper fill: Lam Research. AMAT 'King of Addition', ALD future core.
2-5-2 The Art of Subtraction — Etching and Cleaning
Semiconductor
EDGE / / 5 minutes read

2-5-2 The Art of Subtraction — Etching and Cleaning

Semiconductor etching, or "subtraction," is Lam Research's domain. Advanced processes use precise dry plasma etching. Lam's HAR & ALE are key for 3D NAND/GAA. Post-etch cleaning is critical: TEL dominates front-end. Hermes-Epitek & Scientech dominate CoWoS back-end cleaning, seizing market.
2-5-0 Materialization Project: The Big Three Equipment Companies and the Building Cycle
Semiconductor
EDGE / / 7 minutes read

2-5-0 Materialization Project: The Big Three Equipment Companies and the Building Cycle

Chipmaking (nano-skyscrapers). ASML blueprints; physical build by 'big three'. Process: deposition, lithography, etching, planarization (dozens of repeats). Applied Materials growth; Lam etches; TEL coats; KLA inspects. These teams permeate processes, building a 'steel Great Wall' for chips.
2-4-5 A Comprehensive Analysis of TSMC's Specialty Chemical Supply Chain: Identifying 5 Major Hidden Champions
Semiconductor
EDGE / / 7 minutes read

2-4-5 A Comprehensive Analysis of TSMC's Specialty Chemical Supply Chain: Identifying 5 Major Hidden Champions

Semiconductor materials, continuous consumables, provide stable cash flow. This article identifies five key players: Japanese firms monopolize lithography; EU/US firms, gases. In Taiwan, Tai-Chemical (silane) & Crystalwise (special cylinders) make breakthroughs. Yu Chuan dominates ALD precursors;...