Semiconductor

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The EDGE Semiconductor Research Zone provides in-depth analysis of the global chip industry's complex supply chain, from FinFET to silicon photonics. We cover AI, geopolitics, and rapid tech iteration with continuously updated insights, empowering you to master critical variables and make informed decisions.

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The Counterattack of the 5-3-2 Square: Innolux (3481), Powertech Technology (6239), and FOPLP Panel Level Packaging's Cross-Industry Massacre
Semiconductor
EDGE / / 10 minutes read

The Counterattack of the 5-3-2 Square: Innolux (3481), Powertech Technology (6239), and FOPLP Panel Level Packaging's Cross-Industry Massacre

FOPLP squares cut wafer edge loss, boost capacity 7x, halve costs. Innolux leverages depreciated panel fabs for extreme cost in auto/power ICs, targeting NXP. Though not for top AI, its 'waste alchemy' disrupts OSATs, sparking a cross-domain packaging cost war.
5-3-3 Taiwan's Home-Field Advantage for Strategic Overtaking: FOPLP's Dedicated Arsenal, Spotlighting Key Players Tianhong (6937) and Qunyi (6664) and Their Transformative Profits
Semiconductor
EDGE / / 9 minutes read

5-3-3 Taiwan's Home-Field Advantage for Strategic Overtaking: FOPLP's Dedicated Arsenal, Spotlighting Key Players Tianhong (6937) and Qunyi (6664) and Their Transformative Profits

FOPLP drives packaging change; foreign giants' physical limits give Taiwan PCB firms home advantage. Qunyi & Grand Tech penetrate supply chain with large-area tech, earning massive profits. Tianhong mastered PVD/ALD core processes, breaking US-Japan monopoly. Taiwan firms moved peripheral to core...
5-3-4 The End of Silicon and the Rise of Glass: TGV Shattering Curse and the Alliance War of Titan Tech (8027) and C Sun (2467)
Semiconductor
EDGE / / 5 minutes read

5-3-4 The End of Silicon and the Rise of Glass: TGV Shattering Curse and the Alliance War of Titan Tech (8027) and C Sun (2467)

This article explores glass substrate bottlenecks, TGV's fragility, and Intel's strategy to overtake TSMC. Highlights the Titan Tech (laser), C Sun (thermal), Quun Yi (coating), Unimicron (substrate) alliance to overcome physical hurdles. Details 'equipment first, substrates later' investment log...
The 5-4-0 Test Time Money Printer: KYEC's (2449) Burn-in Moat and Taiwan's Test Arms Dealers' Feast
Semiconductor
EDGE / / 7 minutes read

The 5-4-0 Test Time Money Printer: KYEC's (2449) Burn-in Moat and Taiwan's Test Arms Dealers' Feast

Surging AI chip complexity drives exponential test times; KYEC (2449) is a core beneficiary. Burn-in test demand surged to prevent early chip failure. KYEC's self-made burn-in ovens' cost/customization edge builds a strong moat, securing NVIDIA/Google orders. This boosts Taiwan's probe card, sock...
5-4-1 Optical's Microscopic Inspectors: The Needle-in-a-Haystack Challenge of AOI Inspection and the Data Flywheel
Semiconductor
EDGE / / 6 minutes read

5-4-1 Optical's Microscopic Inspectors: The Needle-in-a-Haystack Challenge of AOI Inspection and the Data Flywheel

Advanced packaging's rise makes AOI key to yield. 2D-to-3D tech shift ensures micro-bump precision through every-step AOI. Core moat: defect data flywheel trains AI. Machvision, Test Research, et al. eye ~20% CapEx inspection via alliances, tech transformation.
5-4-2 Probe Card War of Attrition: Santest (3595)'s Probe Cleaning Magic and Yung Ching (6683)'s Hybrid Steel Ring
Semiconductor
EDGE / / 6 minutes read

5-4-2 Probe Card War of Attrition: Santest (3595)'s Probe Cleaning Magic and Yung Ching (6683)'s Hybrid Steel Ring

Focusing on semiconductor test consumables: probe cleaning cards & test boards. Santest's dust-free tech solves probe sticking, securing pricing power. Yung Ching offers one-stop high-frequency test board service with a dual front/back-end strategy. AI/advanced process upgrades boost high-frequen...