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The EDGE Semiconductor Research Zone provides in-depth analysis of the global chip industry's complex supply chain, from FinFET to silicon photonics. We cover AI, geopolitics, and rapid tech iteration with continuously updated insights, empowering you to master critical variables and make informed decisions.

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5-4-4 Ultimate System Boss: SLT (System-Level Test) and Chroma ATE (2360)'s EDA-level Adhesion
Semiconductor
EDGE / / 6 minutes read

5-4-4 Ultimate System Boss: SLT (System-Level Test) and Chroma ATE (2360)'s EDA-level Adhesion

Chroma dominates AI chip SLT, vital for simulation, using active thermal control to lock temps in milliseconds, managing intense heat. Deeply coupled with chip firmware, high switching costs & stickiness are ensured. With surging high-stress testing/measurement, Chroma becomes a core AI infra met...
5-4-5 Hongjing Technology (7769) and the Burning Execution Ground: The Death Bathtub Curve of Burn-in (Aging Test)
Semiconductor
EDGE / / 5 minutes read

5-4-5 Hongjing Technology (7769) and the Burning Execution Ground: The Death Bathtub Curve of Burn-in (Aging Test)

AI chips shift to 100% full burn-in inspection from sample testing to overcome 'bathtub curve' early failures. Hongjing (7769) leads global sorters, ensuring ±10μm precision via dynamic thermal compensation for high-temp metal expansion alignment. Its tech is critical for stable global high-end c...
5-4-6 The Ultimate Forensic Examiner: A Microscopic Analysis Platform and the 'Big Three' in Material Analysis and Testing
Semiconductor
EDGE / / 7 minutes read

5-4-6 The Ultimate Forensic Examiner: A Microscopic Analysis Platform and the 'Big Three' in Material Analysis and Testing

This article explores how the 'Big Three' in semiconductor testing act as ultimate forensic examiners, using FIB and TEM to overcome AOI blind spots for atomic-level failure analysis. Pan-Chip employs precise techniques for advanced process MA; MA-tek expands globally, capitalizing on localizatio...
6-0 Strategic Outpost —— Runaway Power Consumption and the Collision with 'Physical Walls'
Semiconductor
EDGE / / 6 minutes read

6-0 Strategic Outpost —— Runaway Power Consumption and the Collision with 'Physical Walls'

6-0 Strategic Outpost: Runaway Power & Physical Walls. AI/GPU surges stress data centers (consumption, limits, Joule heating, transient currents). Article covers 'Sixth Battlefield' solutions (HV rack power, 3rd-gen semiconductors, liquid cooling) for energy system transformation, analyzing Delta...
6-1-1 Ending AC Loss: HVDC (High-Voltage Direct Current)'s Overt Strategy for Cost Savings
Semiconductor
EDGE / / 7 minutes read

6-1-1 Ending AC Loss: HVDC (High-Voltage Direct Current)'s Overt Strategy for Cost Savings

HVDC cuts data center AC/DC conversion losses. 380V centralized rectification boosts HVDC efficiency, despite current sharing & arc suppression. 100kW+ AI rack power strains 48V. Industry shifts to 800V power chains & SiC, reshaping global power/materials.
6-1-3 Duel of the Two Giants in the Power Supply Industry (II): Lite-On Technology (2301)'s High-Efficiency Surprise Attack
Semiconductor
EDGE / / 8 minutes read

6-1-3 Duel of the Two Giants in the Power Supply Industry (II): Lite-On Technology (2301)'s High-Efficiency Surprise Attack

Lite-On (2301) counters Delta's integration via an "assassin strategy," focusing on extreme server power density. GaN tech drastically shrinks power supply volume, solving rack space/heat with titanium efficiency, crucial for cloud giants avoiding vendor lock-in. Its Ubiqconn acquisition expands ...