AI chips' extreme V/kA challenge motherboard power, driving 'phase explosion'. PMICs' multi-phase/precision control solves high-load transient response. MPS leads single-chip integration; Renesas builds M&A solutions. Traditional inductors hit limits, making TLVR, M-CLL, vertical power key AI bat...

The 800V trend sets the third-gen semiconductor battleground: Silicon exits; SiC dominates high-voltage power, GaN handles high-frequency conversion. Despite SiC defects/yield causing giant financial crises, AI data centers' rigid high-voltage power demand is SiC's certain long-term growth driver.

Analyzing the switching philosophy of power MOSFETs and IGBTs in AI servers. MOSFETs provide high-frequency power like microscopic faucets; Super Junction's 3D structure tackles silicon heating, securing the sub-48V market. IGBTs' high voltage resistance protects data center front ends, aiding ma...

AI chip power jumps rapidly; traditional power's physical delays prevent instant supply. BBU shifts from backup to a frontline 'peak-shaving & valley-filling' power buffer. High-rate cells & microsecond BMS allow BBUs to bridge power gaps, preventing chip crashes. This is now standard for AI serv...

Lite-On (2301) counters Delta's integration via an "assassin strategy," focusing on extreme server power density. GaN tech drastically shrinks power supply volume, solving rack space/heat with titanium efficiency, crucial for cloud giants avoiding vendor lock-in. Its Ubiqconn acquisition expands ...

Delta Electronics (2308) is now an AI data center integrator. Facing high-power thermal runaway, it offers integrated grid-to-chip liquid cooling via power/thermal co-design and an HVDC end-to-end blueprint. Its high vertical integration and single responsibility secured cloud giants, dictated sp...