Computing power = national strength; silicon & AI reshape the world. EDGE Semiconductor Research analyzes shifts (advanced processes to Trump 2.0) via tech, market, geopolitics, decision. Its 7-part series helps you pierce stock noise, grasp tech bottleneck & supply chain shift logic, becoming a ...
【Insight Subscription Plan】Say Goodbye to Retail Investor Mentality: Using "Quantitative Fund Flow" and "Consensus Data" to Build Your Alpha Trading System
Ditch retail investor thinking; build an Alpha trading system with institutional data. Our Quantamental engine combines high-dimensional quantitative fund flows and AI insights. Our weekly reports decode Smart Money trends via ML and provide institutional semiconductor forecasts for earnings-pric...
How We Build a "Living Knowledge Base" via Editor-Driven AI Curation
EDGE redefines research via AI-Assisted Curation. Human editors feed AI with quant data and elite reports to distill signals. We strictly fact-check to eliminate noise. Zero disposable content—just a continuously updated Living Knowledge Base.
6-2-2: The Core Driver of 800V: The Physical Battleground of Silicon Carbide (SiC) and Gallium Nitride (GaN)
The 800V trend sets the third-gen semiconductor battleground: Silicon exits; SiC dominates high-voltage power, GaN handles high-frequency conversion. Despite SiC defects/yield causing giant financial crises, AI data centers' rigid high-voltage power demand is SiC's certain long-term growth driver.
6-2-1 The Faucet of Electric Current: The Switching Philosophy of MOSFET and IGBT
Analyzing the switching philosophy of power MOSFETs and IGBTs in AI servers. MOSFETs provide high-frequency power like microscopic faucets; Super Junction's 3D structure tackles silicon heating, securing the sub-48V market. IGBTs' high voltage resistance protects data center front ends, aiding ma...
6-1-4 Active Lifeline: BBU (Backup Battery) Shifts from Logistics to the Frontline
AI chip power jumps rapidly; traditional power's physical delays prevent instant supply. BBU shifts from backup to a frontline 'peak-shaving & valley-filling' power buffer. High-rate cells & microsecond BMS allow BBUs to bridge power gaps, preventing chip crashes. This is now standard for AI serv...
6-1-3 Duel of the Two Giants in the Power Supply Industry (II): Lite-On Technology (2301)'s High-Efficiency Surprise Attack
Lite-On (2301) counters Delta's integration via an "assassin strategy," focusing on extreme server power density. GaN tech drastically shrinks power supply volume, solving rack space/heat with titanium efficiency, crucial for cloud giants avoiding vendor lock-in. Its Ubiqconn acquisition expands ...
6-1-2 Showdown of Two Giants in the Power Industry (Part 1): Delta Electronics (2308)'s Comprehensive Empire
Delta Electronics (2308) is now an AI data center integrator. Facing high-power thermal runaway, it offers integrated grid-to-chip liquid cooling via power/thermal co-design and an HVDC end-to-end blueprint. Its high vertical integration and single responsibility secured cloud giants, dictated sp...
6-1-1 Ending AC Loss: HVDC (High-Voltage Direct Current)'s Overt Strategy for Cost Savings
HVDC cuts data center AC/DC conversion losses. 380V centralized rectification boosts HVDC efficiency, despite current sharing & arc suppression. 100kW+ AI rack power strains 48V. Industry shifts to 800V power chains & SiC, reshaping global power/materials.
5-4-6 The Ultimate Forensic Examiner: A Microscopic Analysis Platform and the 'Big Three' in Material Analysis and Testing
This article explores how the 'Big Three' in semiconductor testing act as ultimate forensic examiners, using FIB and TEM to overcome AOI blind spots for atomic-level failure analysis. Pan-Chip employs precise techniques for advanced process MA; MA-tek expands globally, capitalizing on localizatio...
5-4-5 Hongjing Technology (7769) and the Burning Execution Ground: The Death Bathtub Curve of Burn-in (Aging Test)
AI chips shift to 100% full burn-in inspection from sample testing to overcome 'bathtub curve' early failures. Hongjing (7769) leads global sorters, ensuring ±10μm precision via dynamic thermal compensation for high-temp metal expansion alignment. Its tech is critical for stable global high-end c...
