Featured posts
EDGE / / 9 minutes read

6-3-0 The Origin of Heat: Chemical Warfare at the Microscopic Interface and Invisible Killers

This article analyzes semiconductor interface thermal challenges, revealing the 'pump-out effect' caused by thermal expansion coefficient differences. Emphasizing AI server long-term stability, it introduces Phase Change Materials (PCM) that, via solid-liquid conversion, fill air gaps and resist ...
EDGE / / 8 minutes read

6-2-4: The Gatekeeper of Safety Regulations – The EMI Nightmare at High Frequencies and the Front-Line Arsenal

The article examines AI server EMI challenges from high-frequency switching; common mode inductors & decoupling capacitors ensure voltage stability. Murata, with material science & nanoscale MLCCs, builds AI supply chain barriers, showing structural growth in high-end passive components from comp...
EDGE / / 11 minutes read

6-2-3 Explosion of Power Phases: The Inductor War of PMIC, M-CLL, and TLVR

AI chips' extreme V/kA challenge motherboard power, driving 'phase explosion'. PMICs' multi-phase/precision control solves high-load transient response. MPS leads single-chip integration; Renesas builds M&A solutions. Traditional inductors hit limits, making TLVR, M-CLL, vertical power key AI bat...
EDGE / / 11 minutes read

6-2-2: The Core Driver of 800V: The Physical Battleground of Silicon Carbide (SiC) and Gallium Nitride (GaN)

The 800V trend sets the third-gen semiconductor battleground: Silicon exits; SiC dominates high-voltage power, GaN handles high-frequency conversion. Despite SiC defects/yield causing giant financial crises, AI data centers' rigid high-voltage power demand is SiC's certain long-term growth driver.
EDGE / / 9 minutes read

6-2-1 The Faucet of Electric Current: The Switching Philosophy of MOSFET and IGBT

Analyzing the switching philosophy of power MOSFETs and IGBTs in AI servers. MOSFETs provide high-frequency power like microscopic faucets; Super Junction's 3D structure tackles silicon heating, securing the sub-48V market. IGBTs' high voltage resistance protects data center front ends, aiding ma...
EDGE / / 8 minutes read

6-1-4 Active Lifeline: BBU (Backup Battery) Shifts from Logistics to the Frontline

AI chip power jumps rapidly; traditional power's physical delays prevent instant supply. BBU shifts from backup to a frontline 'peak-shaving & valley-filling' power buffer. High-rate cells & microsecond BMS allow BBUs to bridge power gaps, preventing chip crashes. This is now standard for AI serv...
EDGE / / 8 minutes read

6-1-3 Duel of the Two Giants in the Power Supply Industry (II): Lite-On Technology (2301)'s High-Efficiency Surprise Attack

Lite-On (2301) counters Delta's integration via an "assassin strategy," focusing on extreme server power density. GaN tech drastically shrinks power supply volume, solving rack space/heat with titanium efficiency, crucial for cloud giants avoiding vendor lock-in. Its Ubiqconn acquisition expands ...
EDGE / / 9 minutes read

6-1-2 Showdown of Two Giants in the Power Industry (Part 1): Delta Electronics (2308)'s Comprehensive Empire

Delta Electronics (2308) is now an AI data center integrator. Facing high-power thermal runaway, it offers integrated grid-to-chip liquid cooling via power/thermal co-design and an HVDC end-to-end blueprint. Its high vertical integration and single responsibility secured cloud giants, dictated sp...
EDGE / / 7 minutes read

6-1-1 Ending AC Loss: HVDC (High-Voltage Direct Current)'s Overt Strategy for Cost Savings

HVDC cuts data center AC/DC conversion losses. 380V centralized rectification boosts HVDC efficiency, despite current sharing & arc suppression. 100kW+ AI rack power strains 48V. Industry shifts to 800V power chains & SiC, reshaping global power/materials.